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5G Factor: Key MWC24 Takeaways – Semis and Devices

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Contenuto fornito da The Futurum Group. Tutti i contenuti dei podcast, inclusi episodi, grafica e descrizioni dei podcast, vengono caricati e forniti direttamente da The Futurum Group o dal partner della piattaforma podcast. Se ritieni che qualcuno stia utilizzando la tua opera protetta da copyright senza la tua autorizzazione, puoi seguire la procedura descritta qui https://it.player.fm/legal.

In this episode of The 5G Factor, our series that focuses on all things 5G, the IoT, and the 5G ecosystem as a whole, I’m joined by my colleague and fellow analyst, Olivier Blanchard, for a look at the top 5G semiconductor and device takeaways from our conversations and sessions at Mobile World Congress 2024. The major takeaways we had included Micron’s UFS and memory portfolio innovations with the Samsung Galaxy S24 series showcasing new GenAI capabilities, Lenovo’s Integrated Edge AI Solution for Telco collaborations with Telefonica and Orange, Lenovo’s new ThinkPad and ThinkBook devices including transparent displays, new Mediatek Dimensity 9300 GenAI features, and Qualcomm’s portfolio-wide breakthroughs across AI, 5G, and Wi-Fi.

Our analytical review focused on:

Micron Delivers UFS, Memory Advances: Spurs Samsung Galaxy 24 AI Innovation. Micron announced that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in an ultra-compact UFS package at 9x13 millimeters (mm). Built on its 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides advances in performance that can enable faster and more responsive experiences on flagship smartphones. Samsung is now incorporating Micron’s low-power double data rate 5X (LPDDR5X) memory and UFS 4.0 mobile flash storage into select devices in the Samsung Galaxy S24 series, which is introducing AI to mobile users worldwide. The Galaxy S24 series is underpinned by Samsung’s suite of generative AI tools, Galaxy AI, which helps amplify experiences from enabling barrier-free communication to maximizing creative freedom. We assess how Micron’s LPDDR5X is a mobile-optimized memory distinguished by offering the advanced capabilities of the 1β (1-beta) process node, while Micron’s UFS 4.0 offers the performance and power needed to store growing amounts of data in today’s AI-driven smartphones.

Lenovo Readies Telcos for Edge AI Renaissance. To support the massive amount of computing moving to the edge, the company is offering Lenovo Integrated Edge AI Solutions for Telco with Lenovo’s ecosystem of partners. Highlights include new multi-cloud edge computing architecture with Telefonica tackles mission critical applications for smart cities, making it simple to leverage data throughout city streets in a wide array of AI use cases, including using video analytics and computer vision to identify smoke and fire, support public safety and improve emergency response times. We delve into how Telefonica leveraging its own Telco Cloud with the range of Lenovo ThinkEdge servers and Motorola’s push-to-talk technology, and is demonstrating through a proof of concept the capabilities of multi-cloud at the edge, AI, and computer vision to alert public safety officials of danger. The new solution orchestrates the entire edge-to-cloud ecosystem, weaving infrastructure, connectivity, and applications together to support public safety and enhance emergency response with real-time AI.

Plus, at MWC24, Lenovo unveiled and expanded the joint innovation partnership for telecom and cloud services to help Orange Group bring high performance and energy efficiency to telco clients worldwide. We appraise why the alliance can deliver telecom advancement, since Orange and Lenovo are also extending the partnership for three more years and launched a shared Sylva project validation center, addressing telco and edge use cases. The program will cover areas critical for evolving telecommunications infrastructure, including supporting operational efficiency, automation, and new open radio access.

Lenovo Transparently Energizes ThinkBook and ThinkPad Portfolio. On the device side, Lenovo launched brand new ThinkPad and ThinkBook business laptops – unveiling AI features that enhance productivity and efficiency – with performance enhancements and multi-mode versatility. Additionally, Lenovo introduced a selection of accessories designed to boost mobile productivity, including the ThinkVision M14t Gen 2 portable display, a USB-C Slim Travel Dock for comprehensive docking on-the-go, and a redesigned ThinkPad Executive 16-inch Backpack that allows for easy carrying of a mobile office. Rounding out the new hardware announcements are new software solutions, including Lenovo Identity Advisor, a digital identity monitoring tool and Smart Connect, a software that unlocks multi-device synergies. Finally, we review Lenovo showcasing a futuristic proof of concept laptop – the ThinkBook Transparent Display Laptop Concept – which features the industry’s first laptop with a 17.3-inch Micro-LED transparent display, providing a fully borderless and see-through display experience.

Mediatek Density 9300 GenAI: New Capabilities. MediaTek is a global fabless semiconductor firm supporting more than two billion connected edge devices every year, who showcased a series of new Generative AI demos, all of which are using the latest generation of APU hardware featured in the Dimensity 9300 flagship smartphone SoC. The new solution highlights several key Generative AI technologies enabled by MediaTek, including multiple new applications running entirely on-device. We examine the solution’s new capabilities such as SDXL Turbo, a text-to-image Stable Diffusion engine that dynamically generates images in real-time, based on user-provided prompts as well as Video Diffusion Generation, which enables fast video diffusion generation, capable of a range of animation styles.

Qualcomm Breaks Ground Across AI, 5G, and Wi-Fi. We saw Qualcomm demonstrating groundbreaking advancements in AI, 5G, and Wi-Fi that can spearhead a new era of intelligent computing everywhere, infusing AI throughout industries, devices, and consumer experiences. By unleashing the potential of AI, the fusion of on-device computing prowess and improved connectivity can empower businesses and individuals to unlock new use cases and applications. At MWC24, Qualcomm showcased on-device AI, intelligent computing, and wireless connectivity products and milestones, poised to accelerate digital transformation, drive a new wave of economic growth, and bring the convergence of AI and connectivity to new regions. We consider why Generative AI is expected to have a broad impact across industries, with estimates that it could add the equivalent of $2.6 trillion to $4.4 trillion to the world economy by 2040.

  continue reading

711 episodi

Artwork
iconCondividi
 
Manage episode 407340705 series 3559513
Contenuto fornito da The Futurum Group. Tutti i contenuti dei podcast, inclusi episodi, grafica e descrizioni dei podcast, vengono caricati e forniti direttamente da The Futurum Group o dal partner della piattaforma podcast. Se ritieni che qualcuno stia utilizzando la tua opera protetta da copyright senza la tua autorizzazione, puoi seguire la procedura descritta qui https://it.player.fm/legal.

In this episode of The 5G Factor, our series that focuses on all things 5G, the IoT, and the 5G ecosystem as a whole, I’m joined by my colleague and fellow analyst, Olivier Blanchard, for a look at the top 5G semiconductor and device takeaways from our conversations and sessions at Mobile World Congress 2024. The major takeaways we had included Micron’s UFS and memory portfolio innovations with the Samsung Galaxy S24 series showcasing new GenAI capabilities, Lenovo’s Integrated Edge AI Solution for Telco collaborations with Telefonica and Orange, Lenovo’s new ThinkPad and ThinkBook devices including transparent displays, new Mediatek Dimensity 9300 GenAI features, and Qualcomm’s portfolio-wide breakthroughs across AI, 5G, and Wi-Fi.

Our analytical review focused on:

Micron Delivers UFS, Memory Advances: Spurs Samsung Galaxy 24 AI Innovation. Micron announced that it is delivering qualification samples of an enhanced version of its Universal Flash Storage (UFS) 4.0 mobile solution with breakthrough proprietary firmware features delivered in an ultra-compact UFS package at 9x13 millimeters (mm). Built on its 232-layer 3D NAND and offering up to 1 terabyte (TB) capacity, the UFS 4.0 solution provides advances in performance that can enable faster and more responsive experiences on flagship smartphones. Samsung is now incorporating Micron’s low-power double data rate 5X (LPDDR5X) memory and UFS 4.0 mobile flash storage into select devices in the Samsung Galaxy S24 series, which is introducing AI to mobile users worldwide. The Galaxy S24 series is underpinned by Samsung’s suite of generative AI tools, Galaxy AI, which helps amplify experiences from enabling barrier-free communication to maximizing creative freedom. We assess how Micron’s LPDDR5X is a mobile-optimized memory distinguished by offering the advanced capabilities of the 1β (1-beta) process node, while Micron’s UFS 4.0 offers the performance and power needed to store growing amounts of data in today’s AI-driven smartphones.

Lenovo Readies Telcos for Edge AI Renaissance. To support the massive amount of computing moving to the edge, the company is offering Lenovo Integrated Edge AI Solutions for Telco with Lenovo’s ecosystem of partners. Highlights include new multi-cloud edge computing architecture with Telefonica tackles mission critical applications for smart cities, making it simple to leverage data throughout city streets in a wide array of AI use cases, including using video analytics and computer vision to identify smoke and fire, support public safety and improve emergency response times. We delve into how Telefonica leveraging its own Telco Cloud with the range of Lenovo ThinkEdge servers and Motorola’s push-to-talk technology, and is demonstrating through a proof of concept the capabilities of multi-cloud at the edge, AI, and computer vision to alert public safety officials of danger. The new solution orchestrates the entire edge-to-cloud ecosystem, weaving infrastructure, connectivity, and applications together to support public safety and enhance emergency response with real-time AI.

Plus, at MWC24, Lenovo unveiled and expanded the joint innovation partnership for telecom and cloud services to help Orange Group bring high performance and energy efficiency to telco clients worldwide. We appraise why the alliance can deliver telecom advancement, since Orange and Lenovo are also extending the partnership for three more years and launched a shared Sylva project validation center, addressing telco and edge use cases. The program will cover areas critical for evolving telecommunications infrastructure, including supporting operational efficiency, automation, and new open radio access.

Lenovo Transparently Energizes ThinkBook and ThinkPad Portfolio. On the device side, Lenovo launched brand new ThinkPad and ThinkBook business laptops – unveiling AI features that enhance productivity and efficiency – with performance enhancements and multi-mode versatility. Additionally, Lenovo introduced a selection of accessories designed to boost mobile productivity, including the ThinkVision M14t Gen 2 portable display, a USB-C Slim Travel Dock for comprehensive docking on-the-go, and a redesigned ThinkPad Executive 16-inch Backpack that allows for easy carrying of a mobile office. Rounding out the new hardware announcements are new software solutions, including Lenovo Identity Advisor, a digital identity monitoring tool and Smart Connect, a software that unlocks multi-device synergies. Finally, we review Lenovo showcasing a futuristic proof of concept laptop – the ThinkBook Transparent Display Laptop Concept – which features the industry’s first laptop with a 17.3-inch Micro-LED transparent display, providing a fully borderless and see-through display experience.

Mediatek Density 9300 GenAI: New Capabilities. MediaTek is a global fabless semiconductor firm supporting more than two billion connected edge devices every year, who showcased a series of new Generative AI demos, all of which are using the latest generation of APU hardware featured in the Dimensity 9300 flagship smartphone SoC. The new solution highlights several key Generative AI technologies enabled by MediaTek, including multiple new applications running entirely on-device. We examine the solution’s new capabilities such as SDXL Turbo, a text-to-image Stable Diffusion engine that dynamically generates images in real-time, based on user-provided prompts as well as Video Diffusion Generation, which enables fast video diffusion generation, capable of a range of animation styles.

Qualcomm Breaks Ground Across AI, 5G, and Wi-Fi. We saw Qualcomm demonstrating groundbreaking advancements in AI, 5G, and Wi-Fi that can spearhead a new era of intelligent computing everywhere, infusing AI throughout industries, devices, and consumer experiences. By unleashing the potential of AI, the fusion of on-device computing prowess and improved connectivity can empower businesses and individuals to unlock new use cases and applications. At MWC24, Qualcomm showcased on-device AI, intelligent computing, and wireless connectivity products and milestones, poised to accelerate digital transformation, drive a new wave of economic growth, and bring the convergence of AI and connectivity to new regions. We consider why Generative AI is expected to have a broad impact across industries, with estimates that it could add the equivalent of $2.6 trillion to $4.4 trillion to the world economy by 2040.

  continue reading

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